Laser Ablation of Styrene–Methacrylate Composites

N. V. Buzin; Бузин Н. В.; G. M. Mukhametova; Мухаметова Г. М.; S. N. Kholuiskaya; Холуйская С. Н.; A. V. Kiselev; Киселев А. В.; V. N. Kalinichenko; Калиниченко В. Н.; A. A. Gridnev; Гриднев А. А.

doi:10.31857/S0023119323010023

Laser Ablation of Styrene–Methacrylate Composites

Autores: Buzin N.V.¹, Mukhametova G.M.¹, Kholuiskaya S.N.¹, Kiselev A.V.¹, Kalinichenko V.N.², Gridnev A.A.¹
Afiliações:
1. Semenov Federal Research Center Institute of Chemical Physics, Russian Academy of Sciences
2. Emanuel Institute of Biochemical Physics, Russian Academy of Sciences
Edição: Volume 57, Nº 1 (2023)
Páginas: 73-79
Seção: ЛАЗЕРНАЯ ХИМИЯ
URL: https://kld-journal.fedlab.ru/0023-1193/article/view/661533
DOI: https://doi.org/10.31857/S0023119323010023
EDN: https://elibrary.ru/DDSTZI
ID: 661533

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Resumo

Various styrene–methacrylate composites with mineral fillers have been studied as a substrate for the deposition of copper tracks on surfaces after laser ablation. It has been revealed that both insufficient laser heating of the substrate with applied varnish and its overheating have a negative effect on chemical copper plating. The use of crosslinked styrene–methacrylate polymers makes it possible to achieve stable copper plating of the laser-treated surface of the varnish-coated substrate. It has been shown that with an appropriate selection of ablation parameters, finely divided minerals, such as talc, celadonite, aquamarine, shungite, chromia, and iron oxide (ocher), can be used as varnish filler for chemical copper plating of laser-treated parts of the substrate.

Palavras-chave

laser ablation, chemical copper plating, crosslinked polymer, talc, mineral filler

Bibliografia

Adelaar H. A method for plating a copper interconnection circuit on the surface of a plastic device. Pat. 2267184 EP. 2010.
Heininger N. // J. Microwave. 2012. V. 6. № 1. P. 46.
Huske M., Kickeilhaim J., Muller J., Eber G. // Mater. Sci. 2002. V. 38. № 8. P. 51.
URL: https://www.lpkfusa.com/products/mid/articles_and_technical_papers/ сайт фирмы “LKPF”, 2021 (дата обращения: 23.08.2021).
Goosey M. Laser-activated dielectric material and method for using the same in an electroless deposition process. Pat. 0212632 GB. 2003.
Balzereit S., Proes F., Altstadt V., Emmelmann C. // Mater. Sci. 2018. V. 23. P. 347. doi: 10-1016/j-addma.2018.08.016
Schrauwen B.A.G. Polycarbonate Composition for laser direct structuring. Pat. 3898808A1 EP. 2020.
Yu Z., Wang J.H., Li Y., Li Y. // Polym. Eng. Sci. 2020.V. 60. № 4. P. 860. https://doi.org/10.1002/pen.25345
Kim K., Lee J., Ryua S. Kim J. // RSC Advances. 2018. V. 8. № 18. P. 9933. https://doi.org/10.1039/c8ra00967h
Jiratti T., Mavinkere R.S., Suchart S., Catalin I.P. // Polymers. 2020. V. 12. № 6. P. 1408. https://doi.org/10.3390/polym12061408
Xu H., Zhang J., Feng J., Zhou T. // Ind. Eng. Chem. Res. 2021. V. 60. № 24. P. 8821. https://doi.org/10.1021/acs.iecr.1c01668
Rytlewski P., Jagodzinski B., Karasiewicz I.N., Augustyn P., Kaczor D., Malinowski R., Szablinski K., Mazurkiewicz M., Moraczewski K. // Materials. 2020. V. 13. № 10. P 2224. https://doi.org/10.3390/ma13102224
Zhang J., Zhou T., Wen L., Zhang A. // ACS App. Mater. Inter. 2016. V. 8. № 49. P. 33999. https://doi.org/10.1021/acsami.6b11305
Zhang J., Zhou T., Wen Y. // ACS App. Mater. Inter. 2017. V. 9. № 10. P. 8996. https://doi.org/10.1021/acsami.6b15828
Пивоваров Д.А., Голубчикова Ю.Ю., Ильин А.П. // Изв. Томск. политех. университета // 2012. Т. 321. № 3. С. 11.