Mathematical modeling of a microprocessor liquid cooling system

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This work examines the efficiency of the microprocessor-cooling system and maintaining the optimal temperature of electronic components. To do this, experiments were carried out on the existing microprocessor cooling system with control of all main parameters, primarily such as temperature and coolant flow, performance and temperature of the processor. Based on the data obtained, a mathematical model was built that describes the change in microprocessor power and allows one to calculate the temperatures and speeds of coolants, as well as obtain the most effective modes for the operation of the cooling system. The obtained experimental data and mathematical model make it possible to predict the required power of the cooling system and the operating parameters of microelectronic components, which is especially important when new generations of microprocessors with the highest performance appear. The data obtained also makes it possible to calculate parameters for existing processors in order to maximize the efficiency and reliability of their operation, which is also relevant for other electronic devices, in particular microcontrollers.

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А. Andreev

Russia Federal State Budgetary Educational Institution of Higher Education, Astrakhan State Technical

Email: aresut79@mail.ru
俄罗斯联邦, Astrakhan

A. Semenov

Russia Federal State Budgetary Educational Institution of Higher Education, Astrakhan State Technical

编辑信件的主要联系方式.
Email: aresut79@mail.ru
俄罗斯联邦, Astrakhan

参考

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2. Fig. 1. Change in temperature of the main components and cores of the processor (a), processor power (b) and frequency (c) over time

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3. Fig. 2. A test bench for studying the cooling of a computer processor: 1 - heat exchanger on the processor, 2 - pump, 3 - rotameter, 4, 6, 12, 13 - thermocouples, 5 - shut-off valve, 7 - expansion tank, 8 - thermostat with a stirrer with a heat-electric heater and a refrigerant coil (refrigeration machine), 9 - air separation cover, 10, 11 - control valves, 14 - heater

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4. Fig. 3. Temperature change in a liquid cooling system: □ – temperature at the radiator inlet, ‒ – temperature at the radiator outlet, ° – temperature at the water block inlet, ◊ – temperature at the water block outlet, ∆ – temperature at the air inlet to the fan, × – temperature at the air outlet from the fan

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5. Fig. 4. Dependence of the processor temperature on: the temperature of the water entering the water block – a), the processor power on the temperature of the water entering the water block – b), the processor power on the processor temperature – c) at flow rates of 0.3 l/min (∆), 0.55 l/min (□), 1 l/min (°).

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6. Fig. 5. Temperature differences in the elements of the processor cooling system at different temperatures at the input and output of each element of the system.

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7. Fig. 6. Dependence of the processor temperature on the temperature of the water entering the water block – a), processor power on the temperature of the water entering the water block – b), water heating on the temperature of the water entering the water block – c), processor power on the processor temperature – d), at flow rates of 0.3 l/min (∆), 0.55 l/min (□), 1 l/min (°), 1.2 l/min (×).

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8. Fig. 7. Dependence of the processor heat exchanger characteristics on the water temperature according to experimental data a), according to data from the mathematical model b) at a flow rate of 0.3 l/min (◊), 0.6 l/min (□). 0.9 l/min (∆), 1.2 l/min (×).

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9. Fig. 8. Calculated dependence of the heat transfer coefficient on the water temperature at a flow rate of 0.3 l/min (◊), 0.6 l/min (□). 0.9 l/min (∆), 1.2 l/min (×).

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