Parameters matching of the thermoelectric system parameters for cooling heat-loaded electronics elements

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A thermoelectric cooling and thermal control system for electronic devices is considered. Based on a mathematical model using the operating characteristics of a serial thermoelectric module as initial data, calculations of the energy characteristics of a thermoelectric cooling system were carried out, taking into account its thermal resistances. The calculation results are presented in the form of diagrams, which allow for a coordinated selection of the system’s thermal resistances, ensuring the specified values of the cooling capacity and temperature difference.

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作者简介

Е. Vasil’ev

Institute of Computational Modelling, Siberian Branch, Russian Academy of Sciences

编辑信件的主要联系方式.
Email: ven@icm.krasn.ru
俄罗斯联邦, Krasnoyarsk

参考

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2. Fig. 1. Schematic diagram of a thermoelectric cooling and thermal control system: 1 — heat-loaded element, 2 — heat distributor, 3 — thermoelectric module, 4 — heat removal device.

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3. Fig. 2. Q(I) dependencies for ΔT0 = –10 oC: 1 – RT = 0.1 K/W, RS = 0.1 K/W, 2 – RT = 0.3 K/W, RS = 0.1 K/W, 3 – RT = 0.1 K/W, RS = 0.3 K/W, 4 – RT = 0.3 K/W, RS = 0.3 K/W.

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4. Fig. 3. Q(I) dependencies for ΔT0 = –20 оС: 1 – RT = 0.1 K/W, RS = 0.1 K/W, 2 – RT = 0.3 K/W, RS = 0.1 K/W, 3 – RT = 0.1 K/W, RS = 0.3 K/W, 4 – RT = 0.3 K/W, RS = 0.3 K/W.

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5. Fig. 4. Cooling capacity diagram, the curves show Qmax values ​​in Watts.

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6. Fig. 5. Coefficient of performance diagram, with εmax values ​​indicated on the curves.

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